Case Study

Case Study: TI Leverages Its Low Frequency RFID Technology To Improve Wafer Tracking In Manufacturing

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Operations Data

  • Texas Instruments Incorporated provides innovative DSP and analog technologies to help our customers create the world's most advanced electronics. Our real-time signal processing technology permeates daily life in many different ways, from digital communications and entertainment to medical services, automotive systems and a wide range of applications in between.
  • Texas Instruments is the world's largest integrated manufacturer of radio frequency identification (RFID) transponders and reader systems. There are more than 600 million TI RFID tags on the market today.
  • Capitalizing on its competencies in highvolume semiconductor manufacturing and microelectronics packaging, TI is a visionary leader at the forefront of establishing new markets and international standards for RFID applications. TI has been utilizing low frequency RFID tags in its manufacturing process for more than 10 years.
  • TI has received Fortune's "Most Admired Companies" – ranked No. 1 in the semiconductor industry – 2007 for the 4th consecutive year; selected as Fortune's "100 Best Companies to Work For in America" – 2008 for the 9th year; chosen as Working Mother's "100 Best Companies for Working Mothers" – 2007 for the 12th consecutive year; Member of Dow Jones Sustainability World Indexes, chosen for industry leadership in corporate sustainability – 2007 for the 2nd consecutive year; won the Corporate Responsibility Officer's "100 Best Corporate Citizens" – 2007 for the 4th consecutive year.
  • Problem

    More than 10 years ago, Texas Instruments realized an opportunity to improve its inventory control, product tracking and make further enhancements to its automated manufacturing process. Specifically, TI wanted to understand – at any given point of a product development cycle – where a product was located and be able to generate a report that could provide customers a status on product manufacturing.

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